Call for Papers fo Comsol Conference 2013 –

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Last modified: 8 May 2023

The Program Committee for the 9th annual Comsol Conference on multiphysics simulation is pleased to invite engineers and researchers from around the globe to begin submitting abstracts describing their designs, projects and achievements for presentation at the Conference. This year`s European Conference will be held at the Beurs-World Trade Center Rotterdam, on October 23-25.

The COMSOL Conference connects more than 2,000 engineers, researchers and scientists worldwide, providing them with the chance to showcase their work, share innovative technologies and best practices, as well as with the opportunity to meet with the makers of Comsol Multiphysics. The Conference focuses on advancing cross-discipline and multiphysics simulation by providing Conference attendees with a multitude of hands-on minicourses, networking opportunities, keynote talks from industry leaders, and over 850 user presentations.

Highlights of the Conference Include:
# Multiphysics minicourse sessions taught by Comsol specialists that cover a wide array of disciplines and topics including electrical, mechanical, fluid and chemical applications.
# Keynote speeches from industry leaders and prominent researchers which in the past have included the DuPont Company, Ford Motor Company, Microsoft Corporation, Robert Bosch, Toyota Research Institute, and others.
# Opportunities to interact with a panel of industry experts on multiphysics simulation.
# An exhibition showcasing the services and products offered by Comsol Partners and Certified Consultants to enhance and enrich your simulation experience.
# The announcement of a new version of Comsol Multiphysics. Be the first to hear about new tools and technologies added to the Comsol Multiphysics product suite.

“Besides the many training sessions, the Conference will provide attendees with a unique chance to exchange ideas with expert peers in their areas of interest,” says Tycho van Noorden, Program Committee Chair of the Rotterdam Conference. Abstract submissions will be reviewed by a Program Committee of 20 leaders in multiphysics simulation. This year, the Program Committee comprises an impressive assembly of scientists and researchers from Airbus France, L`Oréal, Medtronic, Sharp, Siemens, and STMicroelectronics.

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Comsol BV

COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics® product is an integrated software environment for... Read more